| LEADER 00000nam 2200000uu 4500 |
| 001 48695 |
| 003 ULIBM |
| 008 180326s20169999eng 000 0 eng d |
| 020 ^a9781849199346
|
| 050 0 ^aTK7874^bO35H
|
| 100 1 ^aOgrenci-Memik, Seda
|
| 245 10 ^aHeat management in intergrate circuits :^bon-chip and systems-level monitoring and cooling /^cSeda Ogrenci-Memik
|
| 260 ^aLondon, United Kingdom :^bThe Institution of Engineering and Technology,^c2016
|
| 300 ^aix, 253 p. :^billustrations
|
| 490 0 ^aMaterials, circuits and devices series, 28.
|
| 650 0 ^aIntegrated circuits^xDesign and construction.
|
| 650 0 ^aElectronic circuits^xTemperature compensation.
|
| 945 ^p5640^l0^i201701695 |
| 999 ^aRodjaney
|